For 15 years the ANGA COM is Europe’s leading trade and convention fair for broadband and content.
Even this year EFB-Elektronik was present in the area of data- and network technology. The focuses of the exhibition were the INFRALAN® Splicer and the INFRALAN® System Rack.
The innovative INFRALAN® Splicer has been presented at the live product demonstration as world’s first splice device with build-in crimptool. Also the INFRALAN® System Rack, a modular expendable 19” cabinet system for flexible use aroused enthusiasm.
The ANGA COM is an important linchpin for EFB as to demonstrate the wide product range on international level and to make new and interesting contacts. We appreciate the intensive consultations and hope to welcome you at our booth again on the next ANGA COM.